Package Development Engineer
Onsemi
$150,000 - $249,780 / year
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Description
- Lead package development from concept through production release.
- Define package architecture, materials selection, and assembly process flow.
- Develop and optimize substrate designs including stack-up, routing, power planes, via structures, and thermal features.
- Drive flip-chip integration, bump design, underfill selection, and assembly process optimization.
- Develop passive component integration strategies for capacitors, resistors, and magnetic components.
- Perform electrical, thermal, and mechanical performance optimization.
- Lead package qualification and reliability testing per JEDEC and IPC standards.
- Conduct root cause analysis and implement corrective actions for package failures.
- Collaborate with OSATs and suppliers on DFM, process development, yield improvement, and cost reduction.
- Support NPI execution and transfer technologies into high-volume manufacturing.
Qualifications
- BS/MS in Electrical Engineering, Materials Science, Mechanical Engineering, or related field.
- 10+ years of semiconductor package development experience.
- Strong expertise in:
- Multi-Phase Power Modules, DrMOS, and SPS packaging
- Advanced substrate design and manufacturing
- Flip-chip assembly and package integration
- Passive component assembly and optimization
- Thermal management and reliability engineering
- High-volume manufacturing and NPI processes
- Experience working with OSATs, substrate suppliers, and material vendors.
- Strong communication skills, with the ability to effectively collaborate with Business Units, cross-functional teams, internal and external manufacturing partners, and customers.
- Proficiency in engineering tools and methodologies, including ACAD, 8D, SPC, DFMEA, DOE.
- Proven ability to lead projects across organizations and cultures in a fast-paced environment.
onsemi is excited to share the base salary range for this position is $150,000.00 to $249,780.00. The Range exclusive of fringe benefits or potential bonuses. The final pay rate for the successful candidate will depend on geographic location, skills, education, experience, and/or consideration of internal equity of our current team members. We also offer a competitive benefits package. https://www.onsemi.com/site/pdf/Benefits-Summary-USA.pdf
More details about our company benefits can be found here:
Benefits
- stock options
About this role
Onsemi is seeking a Package Development Engineer to own semiconductor package design from initial concept through high-volume manufacturing at their San Jose facility. This role demands deep technical leadership across the full package development lifecycle—from defining architecture and substrate design to managing flip-chip integration, thermal optimization, and reliability qualification. You'll drive decisions on materials, assembly processes, and passive component strategies while collaborating closely with internal teams, OSATs, and external suppliers to balance performance, manufacturability, and cost.
The position requires at least 10 years of hands-on semiconductor packaging experience, with demonstrated expertise in multi-phase power modules, advanced substrate design, flip-chip assembly, and thermal management. You should be fluent in engineering tools like ACAD, 8D, and DOE, and comfortable leading cross-functional projects in a fast-paced environment. This is an in-office role in San Jose with a salary range of $150,000 to $249,780, plus a competitive benefits package.
This opportunity suits an engineer ready to take ownership of complex technical programs and drive manufacturing excellence at scale, particularly if you have a track record working with power module packaging or automotive-grade reliability standards.
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Pay for this role
$150,000 to $249,780 per year
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