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Manager of Field Applications Engineering, USA

Baya Systems

Salary undisclosed

Austin, Texas, United States; Santa Clara, California, United StatesOn-siteExpert

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Description

Baya Systems is inspired by the baya bird, also known as the weaver. Baya birds weave very unique and intricate hanging nests from different materials. The nests are robust and safe while being extremely lightweight and efficient.

Baya is a fast-moving Series B startup built by serial entrepreneurs with a vision to accelerate intelligent computing in the emerging chiplet era.  We focus on software-driven, unified fabric solutions for single-die and multi-die systems. We design and license disruptive intellectual property for use in semiconductor chips, with software development platforms to simplify the design process and reduce the time to market for complex System-on-Chip (SoC) and multi-chiplet systems. This enables our partners to innovate and deliver compelling solutions for data center, infrastructure, AI, Automotive, and Edge IoT markets. We are looking for energetic and dedicated individuals share our passion for enabling innovation and excellence in the semiconductor industry that empowers game-changing products and services!

 

Manager, Field Applications Engineering 
 
Role Overview:
 
Lead and grow a world-class Field Applications Engineering (FAE) team across the USA. You will drive the technical adoption, integration, and design-win pipeline for our next-generation fabric interconnect silicon IP. You will be responsible for both Pre AND Post sales support. This is a very hands on role with signifiant individual contribution
 
  • Position: Senior Manager, Field Applications Engineering
  • Location: Santa Clara, CA primary-Austin, TX optional
  • North America
  • Travel: Up to 30% travel required
Key Responsibilities
Team Leadership & Development
  • Manage: Lead a distributed team of senior FAEs across the USA
  • Hire: Recruit and onboard top-tier engineering talent in key regional hubs.
  • Coach: Provide continuous technical mentorship and professional development.
  • Align: Set clear regional goals aligned with corporate business objectives.
  • Grow collaterals, to enable improved efficiency / easy of adoption by the customer
Technical Account Management & Sales Support
  • Drive Strategy: Partner with regional sales directors to secure high-value design wins.
  • Own Delivery: Act as the escalations point for critical customer technical issues.
  • Guide Evaluation: Oversee customer proof-of-concepts, evaluations, and architectural reviews.
  • Present: Deliver technical keynotes, deep-dives, and product demonstrations to C-level executives.
Product & Ecosystem Collaboration
  • Feedback Loop: Funnel regional customer requirements directly to internal R&D and Product Management.
  • Influence Roadmap: Use market insights to shape the future fabric interconnect IP roadmap.
  • Enablement: Create application notes, whitepapers, and training collateral for regional ecosystems.
Required Qualifications
Experience & Education
  • Education: Bachelor’s degree in Electrical Engineering, Computer Engineering, or a related STEM field.
  • Management: 5+ years of experience managing customer-facing engineering teams (FAE or Technical Support).
  • Industry: 10+ years in the semiconductor, silicon IP, or high-performance networking sectors.
Technical Expertise
  • IP Knowledge: Deep understanding of Network-on-Chip (NoC), AMBA protocols (CHI, AXI, ACE), or PCIe/CXL fabrics.
  • Design Flow: Familiarity with front-end ASIC design, SoC architecture, RTL verification, and EDA tools (Synopsys, Cadence, Siemens).
  • Systems: Insight into AI/ML accelerators, data center architectures, and automotive SoC requirements.
Soft Skills & Logistics
  • Communication: Exceptional English verbal and written communication skills.
  • Cross-Cultural: Proven experience managing teams and clients
  • Autonomy: Self-motivated style suited for a fast-paced, early-stage startup environment.
Preferred Qualifications
  • Master’s degree or PhD in Electrical or Computer Engineering.
  • Prior experience working in a fast-growing, venture-backed silicon IP startup.
  • Existing technical relationships with major Tier-1 semiconductor and system companies in the USA

Compensation:

  • Salary commensurate with experience
  • Performance incentives
  • Comprehensive medical, dental, and vision benefits
  • 401(k) retirement plan
  • Equity

 

About this role

Baya Systems is building the software and IP infrastructure for next-generation chiplet systems, and this role puts you at the center of translating that technology into customer wins across North America. You'll lead a distributed team of senior field applications engineers while staying deeply hands-on—driving design-win strategy, owning critical customer escalations, and guiding proof-of-concepts for companies building AI, data center, and automotive solutions. This combines people leadership with direct technical engagement, requiring you to move fluidly between regional sales strategy, customer architecture reviews, and C-level technical presentations.

The position demands substantial semiconductor depth: at least ten years in silicon IP, high-performance networking, or related domains, plus five years managing customer-facing engineering teams. You need to be conversant in NoC architectures, AMBA protocols, PCIe/CXL fabrics, ASIC design flows, and the systems requirements of AI accelerators and data center platforms. Beyond technical credibility, you'll funnel regional customer feedback into product roadmap decisions and create enablement collateral that scales your team's impact.

This is an early-stage Series B environment where self-direction matters as much as expertise. You'll travel up to 30 percent, based primarily in Santa Clara with Austin as an optional secondary location. The role offers competitive salary, performance incentives, comprehensive benefits, 401(k), and equity—suited for someone ready to build a world-class FAE organization in a fast-moving startup.

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