Advanced Package Design Engineer
SK hynix America
$110,000 - $155,000 / year
Need a reasonable accommodation to apply or interview? Contact us.
JobMinglr uses automated technology to recommend jobs based on profile information and job preferences. Match Score does not determine eligibility for a position, prevent a user from viewing or applying to a job, or make hiring decisions on behalf of an employer.
Description
About SK hynix America:
At SK hynix America, we are at the forefront of semiconductor innovation. As a global leader in HBM, DRAM, and NAND flash technologies, we develop the advanced memory solutions powering everything from advanced mobile technology to massive AI data centers. With major investments in the U.S. and a leading position in the global AI revolution, we build the critical infrastructure of the digital landscape and remain committed to sustainable operations. We invite innovative minds to be part of our journey. Here, you will be part of a collaborative team pioneering the next generation of memory technologies, expanding our market footprint, and defining the future of computing.
Work Model: Onsite
Job Summary:
We are seeking a skilled Advanced Package Design Engineer to join our Packaging Engineering team in SK Hynix America. You will be responsible for designing and optimizing high-performance, high-density Interposers for chiplet-based architectures and heterogeneous integration solutions. You’ll collaborate closely with PCB, SI/PI, thermal, and manufacturing teams to deliver robust, manufacturable, and cost-effective package solutions
Responsibilities:
- Design silicon and organic interposers for advanced packaging solutions
- Experience in EDA tools such as Virtuoso/APD, Synopsys Custom Compiler, Siemens Xpedition to create and verify advanced package layouts
- Perform design studies and what if scenario analysis for advanced packaging schemes to optimize the overall package design.
- Create and maintain layout design rules, stack-ups, and layout guidelines
- Collaborate with internal and external stakeholders to ensure seamless advanced packaging technology development
Qualifications:
- Bachelor’s or Master’s degree in Electrical Engineering (Preferred), Mechanical Engineering, Material Science, or a related field.
- 3+ years of experience in semiconductor package design or layout
- Proven experience with layout tools Virtuoso/APD, Synopsys Custom Compiler, Siemens Xpedition
- Understanding of high-speed signal routing, power distribution networks (PDN)
- Familiar with 2.5D/3D packaging technologies, substrate design rules, and large body substrate technologies
- Effective communication skills and ability to work in a fast-paced, cross-functional environment
Preferred Qualifications:
- Currently pursuing a PhD's degree in Electrical Engineering or a related field
- 5+ years of experiences in advanced packaging layout design
- Experience with SI/PI simulation tools (Ansys, HFSS, ADS)
- Proven understanding of high-speed signal routing, power distribution networks (PDN)
- Proven technical understanding of advanced packaging materials, their interactions, failure mechanisms and analytical techniques
Benefits:
- Top Tier health insurance at no employee cost
- Paid day offs: Paid Time Off, Company Holidays, Parental Leave, Happy Fridays
- 401k Matching
- Flexible Spending Account (FSA) for Health Care & Dependent Care
- Educational reimbursement up to $10,000 per year
- Donation Matching and volunteering opportunities
- Corporate discount programs
- Free Breakfast/Lunch/Dinner provided to employees
Compensation:
Our compensation reflects the cost of labor across several U.S. geographic markets, and we pay differently based on those defined markets. Pay within the provided range varies by work location and may also depend on job-related skills and experience. Your Recruiter can share more about the specific salary range for the job location during the hiring process.
Equal Employment Opportunity:
SK hynix America is an Equal Employment Opportunity Employer. We provide equal employment opportunities to all qualified applicants and employees and prohibit discrimination and harassment of any type without regard to race, sex, pregnancy, sexual orientation, religion, age, gender identity, national origin, color, protected veteran or disability status, genetic information, or any other status protected under federal, state, or local applicable laws.
In compliance with federal law, SK hynix America also participates in the federal E-Verify program. Upon accepting an offer of employment, all newly hired individuals will be required to complete Form I-9, which includes verifying identity and legal authorization to work in the United States. Please review the official government posters detailing your rights and protections prior to applying:
About this role
SK hynix America's Packaging Engineering team is looking for someone to design advanced interposers and chiplet-based package architectures that will support next-generation memory solutions for AI and mobile applications. You'll use industry-standard EDA tools like Virtuoso, Synopsys Custom Compiler, and Siemens Xpedition to create layouts, define design rules, and optimize package performance across thermal, signal integrity, and manufacturability constraints. The role requires close collaboration with PCB, simulation, and manufacturing teams to move designs from concept through production.
This position suits engineers with at least three years of semiconductor package design experience and solid command of layout tools and high-speed design principles. A background in 2.5D/3D packaging, substrate technologies, and power distribution networks is essential. While a bachelor's degree in electrical or mechanical engineering is the baseline, candidates pursuing a PhD or holding five-plus years of advanced packaging experience—particularly with SI/PI simulation tools—will stand out. You'll work on-site in San Jose within a fast-paced, cross-functional environment.
The role offers competitive compensation between $110,000 and $155,000, comprehensive health coverage at no employee cost, generous paid time off including parental leave, 401k matching, and up to $10,000 annually for educational reimbursement. The company also provides free meals and supports professional development and community involvement.
This role's local market on JobMinglr
Pay for this role
$110,000 to $155,000 per year
That is the employer's posted range, and where you land in it is usually decided in one conversation. Before that conversation, run the numbers: analyze an offer for this role.
Before you apply, worth reading
How JobMinglr reads this job
Every listing here is scored against your profile before you apply: skills overlap, experience level, location and work arrangement, each weighted and explained. You see the score and the reasons, not just a list. How the matching works.