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Reporting to the Expert System Engineering Manager, the Senior Engineer for Electrostatic Chuck (ESC) is accountable for the design, and delivery of hardware engineering solutions focused on ESC and heaters technology. The Engineer will be responsible for focusing on the development of highly innovative technologies over legacy solutions.

Key Responsibilities

Design and develop Johnsen-Rahbek (JR) and Coulombic-type ESC assemblies for 300mm wafer processing applications.

Requirements

Define ESC clamping voltage, leakage current, and chucking/dechucking performance specifications. Characterize ESC electrical properties including volume resistivity, dielectric constant, and breakdown voltage across process temperature ranges. Analyze and mitigate wafer backside contamination, particle generation, and arcing risks associated with ESC operation.

Support ESC integration with RF bias and DC chucking power supplies in plasma processing chambers. Design multi-zone embedded heater assemblies for uniform wafer temperature distribution across process temperatures (room temperature to 700°C+). Perform thermal modeling and simulation (FEA) to optimize heater layout, power density, and zone configuration.

Develop and validate closed-loop temperature control systems including thermocouple/RTD sensor selection and PID control tuning. Characterize heater uniformity, ramp rates, and thermal response using wafer-level temperature mapping tools. Manage thermal stress and CTE mismatch between heater, ceramic, and base plate materials to ensure long-term reliability.

for ESC performance. Experience with FEA thermal simulation tools (ANSYS, COMSOL, or equivalent). Strong analytical and problem-solving ability with a systematic approach to failure analysis.

Effective communication skills and ability to work in cross-functional teams. Apply today to be part of what’s next. We make the tech that enables the chips in devices which improve lives around the world.

Required Qualifications

Master's degree or PhD in Materials Science, Ceramic Engineering, or related discipline. 3–5 years of experience in semiconductor capital equipment engineering, with direct exposure to ESC or heater technologies. Experience with 300mm wafer processing tools and OEM component qualification processes.

Knowledge of high-purity ceramic fabrication techniques (sintering, plasma spray, anodization). Familiarity with reactive process chemistries (fluorine, chlorine plasmas) and their impact on ESC/heater materials. Solid understanding of electrostatic clamping mechanisms (Coulombic and JR force models) and their process dependencies.

Experience with ceramic materials and thin-film dielectric systems used in semiconductor equipment. Familiarity with thermal management in vacuum environments, including radiation, conduction, and convection heat transfer. Hands-on experience with electrical characterization equipment (LCR meters, high-voltage testers, curve tracers).

Senior Engineer I, System Engineering (Systems and Mechanical Engineering – Electrostatic Chuck (ESC))