Microelectronics Process Engineer (Optical Products)

SpaceX was founded under the belief that a future where humanity is out exploring the stars is fundamentally more exciting than one where we are not. Today SpaceX is actively developing the technologies to make this possible, with the ultimate goal of enabling human life on Mars. MICROELECTRONICS PROCESS ENGINEER (OPTICAL PRODUCTS) At SpaceX we are deploying Starlink, the world's most advanced satellite constellation, to provide broadband internet access to the world.

We design, build, and operate all parts of the system – from the hardware in customers' homes to the satellites on orbit. Our engineers are endlessly curious, love to learn and try out new things, and work collaboratively across disciplines in a dynamic environment to deliver high-impact technology on a global scale. As a Microelectronics Process Engineer for Optical Products, you will develop cutting-edge manufacturing processes for next-generation electro-optic devices which are critical to the success our satellite constellation.

You will work closely with design teams (electrical/mechanical), software teams, equipment vendors, and production technicians to take products from NPI to high volume manufacturing. This role covers microelectronics manufacturing processes such as die attach, wire-bond, AOI, and active alignment.

RESPONSIBILITIES

: Manage new product introduction and develop production processes for Micro-E assemblies Work with machine vendors to procure, operate, and improve device manufacturing equipment Design and execute DOE to optimize microelectronic production processes for high volume and high reliability Collaborate with design teams and provide design feedback to improve manufacturability and reliability of opto-electronic devices Lead investigation on non-conforming hardware to determine root cause and implement reliability improvements Work with factory automation teams to bring development processes to high volume production and track product outcomes.

QUALIFICATIONS

: Bachelor’s degree in electrical engineering, mechanical engineering, materials science, physics, or other engineering discipline 1+ years of hands-on experience working with microelectronics assembly equipment PREFERRED SKILLS AND EXPERIENCE: Advanced technical degree 3+ years of hands-on experience with microelectronics manufacturing processes (die/wire bonding, AOI) Hands-on experience with electro-optical device manufacturing High volume production experience (consumer goods, automotive, etc.) Hands-on experience working in SMT processing and/or related PCBA processes from industry, research, or academic projects Experience with MIL-STD-883, IPC-610 and JEDEC standards relative to micro-electronics Experience with environmental testing of electronic devices Strong desire and ability to learn quickly, adapt and innovate Experience with CAD software Competency with SQL/Python Experience with statistical process control (SPC), design of experiment (DOE), and manufacturing metrics (CPK, OEE, etc.) Experience with basic failure analysis tools and methods (shear test, pull test, X-ray, cross-section, SAM) Excellent communication skills both written and verbal Ability to work both autonomously and as a team in a highly demanding, fast-paced environment ADDITIONAL

REQUIREMENTS

: Ability to life heavy objects, up to 25 Ibs.

COMPENSATION

AND

BENEFITS

00 Your actual level and base salary will be determined on a case-by-case basis and may vary based on the following considerations: job-related knowledge and skills, education, and experience.