Thermal Engineer (Starlink)

SpaceX was founded under the belief that a future where humanity is out exploring the stars is fundamentally more exciting than one where we are not. Today SpaceX is actively developing the technologies to make this possible, with the ultimate goal of enabling human life on Mars. THERMAL ENGINEER (STARLINK) At SpaceX, we are applying our expertise in building rockets and spacecraft to create the world’s largest and most advanced satellite broadband system.

Starlink delivers fast, reliable internet to millions of users through a vertically integrated network of satellites, receiver antennas, lasers, gateways, and sophisticated software. We design, build, test, and operate every part of the system to serve users everywhere on Earth. As a thermal engineer, you are responsible for the thermal design, test, and validation of all Starlink hardware.

This includes but is not limited to phased array antennas, custom silicon design for chips, consumer WiFi, and other RF systems to be developed in the future. 7 in-flight.

RESPONSIBILITIES

: Thermal system design of next-generation phased arrays, gateways, and consumer wireless products – own every component, part, and interface in the design Thermal design of semiconductor packages, from high level concepts to detail thermal simulations and lab testing Devise, build, and run tests to validate the expected performance of the hardware in extreme conditions Automate workflow and pursue operational simplicity to reduce engineering investment in the design cycle Utilize first-principles approach to evaluate sizing cases and impact of design decisions Perform analysis to make recommendations for performance/robustness improvements Produce quality documentation of your work for design

Requirements

and specifications Continuous collaboration with mechanical, electrical, software, and RF design teams BASIC

: Must be available to work extended hours and weekends as needed ITAR

S. S. S.

C. C. S.

Department of State. Learn more about the ITAR here .

QUALIFICATIONS

: Bachelor's degree in engineering discipline 1+ years of experience with mechanical design, electromechanical design, and/or analysis (internship or project team experience is applicable) PREFERRED SKILLS AND EXPERIENCE: Master's degree in relevant engineering discipline 1+ years of experience using scientific programming languages such as MATLAB, Python Experience with Thermal Desktop and ANSYS Workbench Experience with tools for chip thermal design like Flotherm or Icepak Experience with 3D and reduced order thermal modeling Excellent oral and written communication skills Ability to deliver against an aggressive schedule ADDITIONAL

and will not be influenced in any manner by race, color, religion, gender, national origin/ethnicity, veteran status, disability status, age, sexual orientation, gender identity, marital status, mental or physical disability or any other legally protected status. com .