Senior Process Engineer - Coring

As our Senior Process Engineer in Wafer Coring, you'll play a key role in developing and optimising wafer coring processes that support the manufacture of advanced semiconductor devices. You'll drive improvements in process capability, mechanical yield, wafer quality and production efficiency, helping to ensure robust and reliable manufacturing performance. You'll have the opportunity to lead continuous improvement initiatives, tackle complex process challenges and identify innovative solutions that enhance manufacturing capability.

Working closely with colleagues across Engineering, Production, Equipment and Quality, you'll help deliver stable, scalable and high-performing wafer coring operations while supporting the development of next-generation technologies. We're looking for someone who combines strong technical expertise with a proactive, hands-on approach to problem solving. If you're passionate about process optimisation, delivering measurable improvements and working with cutting-edge semiconductor technology, this is an opportunity to make a real impact.

This role is primarily Monday to Friday, 8:00am to 4:30pm, with weekend support required on a rotating basis approximately once every three weeks.

Requirements

to work additional hours to support critical business needs and project deadlines. Own and maintain wafer coring processes performance, ensuring compliance with quality, cost, throughput, and metrics targets. Define and optimise process parameters, establish control plans, and maintain operating specifications and procedures for wafer coring processes.

Initiate and drive continuous improvement programs focused on yield enhancement, cycle time improvement, defect reduction, and cost optimisation. Monitor process capability metrics, perform data analysis and implement improvement actions to ensure robust process control. Investigate technical and quality issues using structured problem-solving methodologies and provide timely engineering disposition.

Evaluate the processability of new products, device under development, and deliver sound process engineering recommendations. Collaborate with equipment engineering and tool suppliers to improve equipment reliability, uptime, and performance. Provide technical training and support to operations and engineering team.

A minimum HNC in Electrical or Electronic or Mechanical Engineering is preferred or suitable experience. Minimum 5 years of experience in wafer pre-assembly or die preparation processes. Wafer Coring experience or Equipment know-how is an advantage.

Hands-on process engineering experience on wafer Dicing, Backgrinding, Edge Grinding and Polishing, Laser Grooving and Marking processes. In-depth knowledge and understanding on process application and material selection used in wafer Coring. Strong understanding on DOE, SPC, FMEA, OCAP and data analysis methodologies.

Demonstrate continuous improvement mindset, high level of commitment, analytical and problem-solving skills. Ability to multi-task, work in flexible assignments, and deliver effective result without close supervision.