Process Development Engineer (Surface-Mount Technology)

CelLink is redefining how power and data move through the world’s most advanced electronics, from electric vehicles to hyperscale data centers. As a Process Development Engineer, you’ll be at the center of that transformation, developing and scaling manufacturing processes for flex-circuit-based interconnects used in high-density server and rack systems. These circuits enable megawatt-class power delivery and ultra-clean signal integrity for next-generation AI and data infrastructure.

Responsibilities

Develop and tune reflow soldering profiles for advanced power-electronic assemblies, including large copper mass and mixed SMT/through-hole designs. Own the setup, operation, and troubleshooting of reflow ovens, solder paste printing, and other process equipment. Analyze thermal profiles and cross-sections to correlate process parameters with solder joint reliability.

Develop and optimize lamination and bonding processes, including press setup, adhesive cure control, and layer alignment. Diagnose and correct leakage, delamination, and voiding issues in laminated or sealed cooling-plate assemblies. Design and release tooling, coupons, and test fixtures in CAD (SolidWorks preferred) to support process development and validation.

Interpret and create engineering drawings and GD&T to ensure correct fit, form, and function. Define and execute DOE and characterization tests, including electrical, mechanical, thermal, and visual inspection. Lead root-cause analysis and corrective actions across soldering, lamination, and bonding processes.

Collaborate with Design, Quality, and Operations to transition new processes into scalable production. Maintain a clean, organized work area and adhere to all safety and environmental standards. Demonstrate CelLink’s core values of integrity, teamwork, self-discipline, and technical excellence.

Perform additional duties as assigned to support evolving business needs.

Minimum Qualifications (Knowledge, Skills, And Abilities)

Bachelor’s degree in Mechanical Engineering, Manufacturing Engineering, Materials Science, or related field. 3–7 years of experience in process engineering for electronics manufacturing, ideally in high-speed interconnects, flex circuits, or PCB production. Experience with data center or high-current electrical component manufacturing is a strong plus.

Deep knowledge of flexible circuit manufacturing, roll-to-roll processes, or high-reliability electronics. Familiarity with power interconnects, busbars, or cable harness replacements used in data center systems. ).

Strong problem-solving and analytical skills with the ability to lead cross-functional investigations and corrective actions. Excellent communication and documentation skills for technical reporting and collaboration. Proven ability to thrive in a fast-paced, hands-on, and highly technical environment.

Preferred Qualifications

Experience with cooling plates, liquid-cooled assemblies, or leak-test methods (helium, pressure decay, bubble, or dye). Background in high-current or high-voltage electronics, such as busbars, power modules, or battery interconnects. Familiarity with thermal characterization, pull/shear testing, or cross-section analysis.

Exposure to laser soldering, selective soldering, or bonded multilayer assemblies. Physical Demands and Work Environment The physical demands described here are representative of those that must be met by an employee to successfully perform the essential functions of this position. Reasonable accommodations may be made to enable individuals with disabilities to perform the functions.

Working Conditions/Hours Salaried Exempt $130,000–$160,000 + Stock Option, with the final salary determined by experience and level.