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Boku Inc. — San Jose, California
About the Company: At SK Hynix Memory Solution, we're at the forefront of semiconductor innovation, developing advanced memory solutions that power everything from smartphones to data centers. As a global leader in DRAM and NAND flash technologies, we drive the evolution of advancing mobile technology, empowering cloud computing, and pioneering future technologies. Our cutting-edge memory technologies are essential in today's most advanced electronic devices and IT infrastructure, enabling enhanced performance and user experiences across the digital landscape.
We're looking for innovative minds to join our mission of shaping the future of technology. At SK Hynix Memory, you'll be part of a team that's pioneering breakthrough memory solutions while maintaining a strong commitment to sustainability. We're not just adapting to technological change – we're driving it, with significant investments in artificial intelligence, machine learning, and eco-friendly solutions and operational practices.
As we continue to expand our market presence and push the boundaries of what's possible in semiconductor technology, we invite you to be part of our journey to creating the next generation of memory solutions that will define the future of computing.
About The Team
SK hynix memory solutions America Inc. A Solidigm), provides industry-leading controller hardware, advanced flash management systems, and firmware for NAND and post 2D-NAND based storage solutions spanning Enterprise, Client and Mobile market segments. We are part of the world's top tier semiconductor supplier, SK hynix, offering Dynamic Random Access Memory chips (DRAM), Flash memory chips (NAND Flash) and CMOS Image Sensor (CIS) for a wide range of distinguished customers globally.
Description We are looking for a driven, team-oriented Senior Signal Integrity Engineer to develop next generation Solid State Drive (SSD) products. This position requires experience in hardware design and signal and power integrity design. A successful candidate will have a good knowledge of state of the art memory device technologies and interfaces such as PCIe Gen 4, 5 and 6, DDR4/5, ONFI NAND and implementation techniques required for high-speed interfaces.
). Expertise in design for optimum signal and power integrity as well as hands-on lab measurements experience is a must.
Responsibilities
Mentoring of engineers. Provide SI/PI expertise for SSD controller package (SoC) substrate design and SSD PCB design. Participate in the design of SSD products which includes: design guidelines, reviewing designs, validation of designs and final reports of work designs.
Support PCB back-end process: defining stack-up and HDI via technologies, part placement, setting routing constraints and reviews.
Requirements
through verification/validation in the lab. Work closely with SoC, FW, package, and circuit design engineers. Documentation and communication to design, product and executive teams.
Debug and root cause analysis at all product development stages, as well as customer escalations.
Minimum Qualifications
BS in Electrical Engineering required; MS in Electrical Engineering is a plus. 3-8+ years of relevant working experience. High-speed SSD board designs, pre layout simulation, post layout simulation and design layout guide generation for PCIe Gen4/5/6, DDR4/5, LPDDR4/4x, NVIO and PDN.
Strong fundamentals in 3D/2D EM simulation tools and transmission line theory. Required experience of EM field solvers, time and frequency domain simulation tools like Sigrity, Allegro, ADS, HFSS, SIWAVE, and HSPICE. Simulation followed by measurement correlation using Oscilloscope, VNA and TDR equipment.