Step into a career with ASM, where cutting edge technology meets collaborative culture. For over 55 years ASM has been ahead of what’s next, at the forefront of innovation and what’s technologically possible. With more than 4,500 ASMers representing 70 nationalities, our people and our advanced semiconductor devices are playing a crucial role in trends such as 5G, cloud computing, AI, and autonomous driving.

But we’re more than just a tech company. We value diversity, inclusion and sustainability as we strive to make a positive impact on the world. Our development programs help support your growth, shaping your future and pushing the boundaries of innovation to unleash potential.

As a Field Process Engineer supporting PEALD Plasma-enhanced Atomic Layer Deposition (PEALD) and Plasma-enhanced Chemical Vapor Deposition ( PECVD) on ASM’s XP8 DCM/QCM platforms, you will act as the on‑site process expert at customer HVM fabs.

Requirements

This role is ideal for engineers who enjoy hands‑on problem‑solving, fast‑paced environments, and contributing to next‑generation semiconductor manufacturing.

Apply today to be part of what’s next. We make the tech that enables the chips in devices which improve lives around the world. We do this with an eye to the future, pushing the boundaries of what’s possible through cutting-edge innovation, and driving the next wave of technological breakthroughs that shape how we live, work, and connect.

com and on LinkedIn , Facebook , Instagram, X and YouTube . ASM is an equal opportunity employer and considers qualified applicants for employment without regard to race, color, religion, age, nationality, social or ethnic origin, sexual orientation, gender, gender identify or expression, marital status, pregnancy, political affiliation, disability, genetic information, veteran status, or any other characteristic protected by law.

Key Responsibilities

Lead process qualification and optimization during tool installs and ramp‑up. Execute structured DOEs to improve film quality, uniformity, and throughput. Troubleshoot process issues using systematic root‑cause analysis.

Partner with customer and ASM teams to drive continuous improvement and tool‑to‑tool matching. Document findings and share learnings across global teams. Customer Engagement Build strong, trust‑based technical relationships with customer engineers.

Anticipate needs and provide sustainable, long‑term solutions. Support escalations with clear communication and action plans. Represent ASM with professionalism and technical credibility.

What Makes You Successful Clear communication, strong troubleshooting methodology, and ability to stay composed under pressure. Highly collaborative, organized, and proactive in solving issues and driving improvements. Adaptable to changing priorities in a high‑volume manufacturing environment.

Qualifications

Master’s or PhD in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or related fields. Experience with deposition processes (PEALD/PECVD), vacuum systems, metrology, and semiconductor manufacturing—preferably HVM and ASM tools. Strong DOE and experimental analysis skills.

Ability to travel up to 25%; escalations may require extended hours/weekends.

HVM Field Process Engineer – PEALD, PECVD